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3D AOI

       

3D BUMP

 

3D Inlay Coin

 

3D雷射鑽孔

 

凹陷剖面圖

 

深度分布圖

Because of high density and high reliability trend for advanced PCB and IC substrate, copper-filling plating and stack-via technology become more popular. As the factors to change plating results are many, plating quality is required to be inspected and monitored. 3D AOI utilizes fast 3D measuring technology to scan all the dimples on panels and also provides statistical reports to mirror copper-filling plating results.

 

High throughput 3D technology for full panel scan.

Provides accurate dimple measuring results proven by traceable 3D standard target.

Plating reliability improved by monitoring copper filling outcome.

 

Complete analysis provides various inspection data and diagrams.

Production mode or engineering mode can be performed by different demands.

Effective dimple analysis tools are equipped to save considerable engineering time.

On-line recheck one by one, and offline recheck inspection result improves the inspection efficiency.

PCB Inspection Series

 
Wiring Inspection Series
 
  Circuit AOI 4.0
Circuit AOI
ArtWork AOI
LineGauge
   
 
IC Substrate, HDI & FPCB Inspection + Measuring Series
 
  3D AOI
Solid Measuring Viewer
LaserVia AOIM
   
 
AFI Series
 
  AFI
FPCB AVI
CSP AFI
   
 
Drilling & Routing Measuring Series
 
  Hole AOI/Express
EZ3D

COF Inspection Series

  COF AOI

Semiconductor Series