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LaserVia AOIM

         

Normal

 

Residual

 

Power weak

 

Missing pad

 

Power over

 

Shift

Traditional laser via inspection were done by human eyes or 3D measuring machines. Laser vias were inspected one by one — it was labor intensive, painstaking, and impractical. Our new LaserVia-AOIM system reduces the inspection time of HDI or ABF panels from hours to seconds. In addition to the inspection of NG vias, it also provides statistical reports to control and to improve the production.

 

The most cost-effective inspection and measuring solutions for laser-drilling demands.

Fast scan for various defects ensures high laser drilling quality.

Powerful analysis tools to optimize and to monitor laser drilling parameters and results.

 

Perfect for Large Window, Conformal, DLD, and Flip Chip laser drilling process.

Dedicated and best-fit detection algorithm of inspection for laser via size, position, and tiny smear.

Easy to learn and setup by one-touch operation.

Offline SPC analysis is available and extra scan is not required when changing new defect inspection criteria.

PCB Inspection Series

 
Wiring Inspection Series
 
  Circuit AOI 4.0
Circuit AOI
ArtWork AOI
LineGauge
   
 
IC Substrate, HDI & FPCB Inspection + Measuring Series
 
  3D AOI
Solid Measuring Viewer
LaserVia AOIM
   
 
AFI Series
 
  AFI
FPCB AVI
CSP AFI
   
 
Drilling & Routing Measuring Series
 
  Hole AOI/Express
EZ3D

COF Inspection Series

  COF AOI

Semiconductor Series