Menu

CSP AFI

     

Foreign Material nearby SM Opening

 

Trace Nick

 

Short under SM

 

SM uneven

CSPAFI integrating AOI+AVI algorithm and advanced Fast-Capturing-Multi-Illumination optical system can balance both detection capability and production. This most effective solution is designed for all kinds of substrate such as 3DIC, SOP, BOL, wire bond, PBGA, SD card, RF, MEMs…etc.
CSPAFI is provided with upgrade flexibility in optical system and software.
Machvision’s RD and service team can provide full supporting to solve customer’s problems of new production or developing products.

 

Quickly creating new project decreases the waiting time and gets into the production promptly.

Fast-Capturing-Multi-Illumination system connected with accurate inspection logic can balance both detection capability and production and also reach the best economic benefits.

Comprehensive software, hardware support and service are provided. Best partner relationship for fast production variation and new product developing.

 

Best optical solution combined with circuit AOI inspection logic provides excellent detection capability for open/short and nick/protrusion trace defects under solder mask.

Innovative inspect logic adapting for solder mask shift can prevent defect skip such as foreign material between bumps and trace short nearby SM opening.

Intellectual parameter setting shortens learning time.

PCB Inspection Series

 
Wiring Inspection Series
 
  Circuit AOI 4.0
Circuit AOI
ArtWork AOI
LineGauge
   
 
IC Substrate, HDI & FPCB Inspection + Measuring Series
 
  3D AOI
Solid Measuring Viewer
LaserVia AOIM
   
 
AFI Series
 
  AFI
FPCB AVI
CSP AFI
   
 
Drilling & Routing Measuring Series
 
  Hole AOI/Express
EZ3D

COF Inspection Series

  COF AOI

Semiconductor Series